CPCA/ECWC13代表团赴德国参加行业奥林匹克盛会--ECWC13
每三年举办一次的行业奥林匹克盛会—世界电子电路大会ECWC13于2014年5月7日在德国纽伦堡市盛大开幕，首先由本次大会主办方EIPC主席Alum Morgan及WECC秘书长致欢迎及感谢辞，并由4位行业专家分别从未来市场 技术发展及市场分析等方面作了开幕演讲报告。
本次论坛会将举行3天共90场Oral演讲，CPCA代表团本次共有16篇论文被评选为Oral演讲，分别为：
Shennan Circuits Co., Ltd，Mr. Cui Rong、Mr. Jiang Zhongming，“The Etch Back Process Of Multilayer Printed Circuit Board”、
Shengyi Technology Co.,Ltd，Mr. Wang Lifeng, “The Study and Research on Pull-Away Phenomenon in Large Holes and Irregular Holes”、
Guangdong Shengyi Technology Co., Ltd，Mr. Su Shiguo，“Preparation of An Innovative Halogen free and Phosphorus free Flame Retardant CCL”、
Guangdong Guanghua Sci-Tech Co., Ltd. ，Mr. Xiao Dingjun，“Electronic-grade Copper Oxide: Application to Copper Electroplating Solution for Via Metallization of HDI Printed Circuit Board”、
Shenzhen KingKrother Electronics Technology Co.Ltd，Mr. Fan Siwei，Mr. Chen Chun,“Investigation of multilayer PCB with embedded magnetic core technology”、
Shenzhen Jinzhou Precision Technology Corp. Mr. Fu Lianyu, “Optimization Of Drilling Parameters By The Investigation Of Drilling Temperature”
Guangzhou Fastprint Circuit Tech Co.,Ltd.，Mr. Hu Menghai，“Analysis of Fiber Crazing and Its Influence to Anti-CAF Capability of PCB” 、
Guangzhou Fastprint Circuit Tech Co.,Ltd.，Mr. Ai Xin，“Study on Processing Of Thermotropic Liquid Crystal Polymer Material”、
Guangzhou Fastprint Circuit Tech Co.,Ltd.，Mr.Wang Hongfei，“Study on Single-ended Vias in High Speed PCB”、
Guangzhou Fastprint Circuit Tech Co.,Ltd.，Mr.Mo Xinman，“Effects of Different Adhesive on PTH Reliability in Rigid-Flex PCB”、
University of Electronic Science and Technology of China ，Mr. Chen Yuanming, “Delamination Prevention of Rigid-flex PCB with Plasma Treatment on Polyimide Film”、
Shenzhen AET Electric Corp.,Ltd， Mr. Zeng Guanglong，“The Application of Treatment for Freestyle RTO Incinerator in the Exhaust Gas and Phenolic Containing Wastewater”、
Shenzhen Kinwong Electronic Inc. Company，Ms. Lu Yuting, “The Reliability Study of Thermo Resistant Ability for Multi-layer heavy copper PCB” 、
Shenzhen Kinwong Electronic Inc. Company，Mr. Du Luquan, “The Method of resin plugging with vacuum lamination”、
Shenzhen Kinwong Electronic Co., LTD，Mr. Chen Xiaoyu，“Study on Impedance Design for Rigid-flex Board”、
Guangdong University of Technology，Ms. Wang Lingfang，“Chip Morphology Of Entry Board Influence On Hole Quality In PCB Drilling Process”、
14篇选为Poster揭示板发表，分别为：
BOMIN Electronics Co.,Ltd，Mr. Chen Shijin，“A Analysis Of The Formation Mechanism Of Voids Inside The Filled Blind Via By Copper Electroplating For HDI Board”、
BOMIN Electronics Co.,Ltd，Mr. Chen Shijin，“Study on Registration Accuracy for Any Layer HDI Board”、
Shennan Circuits Co., Ltd，Mr. Zhou Song，“Analysis on AOI Logic and Resolution”、
Shennan Circuits Co., Ltd，Ms. Yao Tengfei，“The Challenges and Opportunities Brought by Discrete Embedded Technology”、
China Circuit Technology Corporation，Ms. Li Fu，“Discoloration Exploring Of Immersion Tin PCB”、
Shenzhen King Brother Electronics Technology Co.,Ltd.，Mr. Chun Chen，“The Technology In Manufacturing Of Aluminum Substrate Rigid-Flex Board”、
Shengyi Technology Co., Ltd，Mr. Zou Chuanwang，“Structural problems of multilayer Printed Circuit Boards with thick copper foil inner-layer and a new solution”、
Shengyi Technology Co., Ltd，Ms.Li Dan,“Two-Dimensional Fourier Transform Infrared Correlation Spectroscopy in the Study of Curing Reaction of Epoxy-Phenol Novolac Network”、
Shengyi Technology Co.,Ltd，Mr. Zhu Yongming，“LTTA on FR-4 Signal Integrity Measurement”、
Shengyi Technology Co.,Ltd，Mr. He Yueshan，“Benzoxazine Application in Halogen Free CCL”、
Shengyi Technology Co.,Ltd，Mr. Pan Hongjie，“Discussion of technological factors influencing the performances of CCL HAST/CAF”
Shenzhen Suntak multilayer circuit board Co.,Ltd.，Mr. Bai Yaxu，“Research on Technology of Filling HDI Buried Holes And Advantage of Cost Accounting”、
Shenghua Electronics (Huiyang) Co., Ltd. Mr. Zhou Dingzhong，“The Database Analysis of Evaluation System of New Types Small Batch Production about Circuit Board”、
Department of Materials Science, Fudan University，Mr. Yang ZhenGuo，“Additive Fabrication of Conductive Patterns by Printing-Adsorption-Plating Process”。
广州兴森快捷电路科技有限公司王红飞获第十三届世界电子电路大会ECWC13优秀论文奖。
同期举办的微电子系统集成电路展览会SMT Hybird Packaging展场近2万平米，分3个展馆，展出PCB产业较少，SMT产业为主。
5月7日召开的WECC会议上，关于2020年第十五届世界电子电路大会ECWC15的最终主办方，将于明年2月在美国召开WECC会上确定究竟是JPCA还是IPC。
这次CPCA/ECWC13代表团团员以来自中国优秀民族企业的年轻工程技术人员为主，如：汕头超声、深南电路、生益科技、兴森快捷、博敏电子、金百泽、金洲精工、光华科技、电子科大等。这些新一代的后起之秀、新生力量的壮大，预示着行业未来能有更激情创新的发展 。